Podium Raises S$20.4 Million in Series A-1

by Kay Aloha Villamor in November 22nd, 2024

Podium, a Singapore-based cloud platform that helps streamline the design-to-supply process for building production, has raised S$20.4 million in the first close of its Series A-1 funding round. 

Investors 

The round was led by Autodesk, with participation from Schindler and Lendlease. 

Founded in 1982, Autodesk is an application software company serving industries in architecture, engineering, and construction; product design and manufacturing; and media and entertainment.

Podium Use of Funds 

The new funding will support Podium's growth in key markets like Singapore and Australia. 

About Podium 

Podium provides a cloud-based SaaS platform for industrialized construction and design for manufacturing and assembly (DfMA). The platform automates workflows to accelerate design-to-supply processes, optimizing for cost, time, and sustainability. Its mission is to develop scalable, practical software solutions that challenge conventional industry practices. Podium is based in Singapore, with offices in Sydney and Silicon Valley. 

Funding Details 

Company: Podium 

Raised: S$20.4M

Round: Series A-1 

Funding Date: November 2024 

Lead Investor: Autodesk 

Additional Investors: Schindler, Lendlease 

Company Website: https://podium.io/  

Software Category: Construction and Building Design 

Source: https://technode.global/2024/11/21/singapores-podium-raises-15-2m-in-series-a-1-round-led-by-autodesk/ 

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